Feature :   
Excellent capacity of solder-stickiness
Excellent Anti-wet Capacity
Widely used on BGA, PGA, CSP packages and flip chip operation
Suitable for multiple PCB reflow
No-clean and Lead free for environmental protection.
It can be used for rework, sphere or pin attachment to BGA, PGA and CSP packages, and assemble operations such as Flip Chip attachment to PWB substrates. It is a necessary and helpful tool in BGA reballing.

Specification:
Name: NC-559-ASM Solder Paste Welding Flux by AMTECH
Brand: AMTECH
Flux Type: NC-559-ASM ( Include Needles and Piston)
Notice: We will put 1PC needle and 1PC piston for each package, not for each flux.
Volume: 10cc